Semiconductor package

ABSTRACT

A semiconductor package includes a substrate, a conductive layer, a first surface mount device (SMD) and a bonding wire. The substrate has a t top surface. The first conductive layer is formed on the top surface and has a first conductive element and a first pad separated from each other. The first SMD is mounted on the first pad, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.

This application is a continuation-in-part application of U.S.application Ser. No. 15/185,063, filed on Jun. 17, 2016, which is acontinuation-in-part application of U.S. application Ser. No.14/824,210, filed on Aug. 12, 2015 now patented as U.S. Pat. No.9,392,696, which is a continuation-in-part application of U.S.application Ser. No. 14/051,548, filed on Oct. 11, 2013, now patented asU.S. Pat. No. 9,147,664. The entire disclosures of U.S. application Ser.No. 14/051,548, U.S. application Ser. No. 14/824,210 and U.S.application Ser. No. 15/185,063 are incorporated herein by reference.

BACKGROUND Technical Field

The disclosure relates in general to a package structure, and moreparticularly to a semiconductor package.

Description of the Related Art

In the electronics industry, high integration and multiple functionswith high performance become essential for new products. And meanwhile,high integration may cause higher manufacturing cost, since themanufacturing cost is in proportional to its size. Therefore, demandingon miniaturization of integrated circuit (IC) packages has become moreand more critical.

System-in-package (SiP) is now the fastest growing semiconductor packagetechnology since it is a cost-effective solution to high-density systemintegration in a single package, such as the flip-chip ball grid array(FC-BGA) package or the wire-bonded BGA (WB-BGA) package. In asystem-in-package structure, various device components are integrated ina single semiconductor package to reduce the size. Accordingly, thereexists a need to provide a semiconductor package to overcomes, or atleast reduces the above-mentioned problems.

SUMMARY

In one embodiment of the invention, a semiconductor package is provided.The semiconductor package includes a substrate, a first pad, a secondpad, a first conductive element, a surface mount device, a first bondingwire, a second conductive element, a solder resistance layer and aheat-sink. The first pad is formed on the substrate. The second pad isformed on the substrate. The first conductive element is formed on thesubstrate. The surface mount device is mounted on the first pad and thesecond pad. The first bonding wire electrically connects a first bondingarea of the first conductive element with a second bonding area of thefirst pad. The second conductive element is formed on the substrate andformed between the first pad and the first conductive element. Thesolder resistance layer covers a portion of the first bonding area and aportion of the second bonding area. The heat-sink is mounted on thesubstrate and has at least one cavity to accommodate the first pad, thesecond pad, a portion of the first conductive element, the bonding wireand the surface mount device.

Yet, in another embodiment of the invention, a semiconductor package isprovided. The semiconductor package includes a substrate, a first pad, asecond pad, a via-plug, a surface mount device and a heat-sink. Thefirst pad is formed on the substrate. The second pad is formed on thesubstrate. The via-plug is formed in the substrate, covered by a solderresistance layer, located in a space between the first pad and thesecond pad, and electrically connected to the second pad. The surfacemount device is mounted on the first pad and the second pad. Theheat-sink is mounted on the substrate, having at least one cavity toaccommodate the first pad, the second pad, a portion of the solderresistance layer and the surface mount device.

In yet another embodiment of the present invention, a semiconductorpackage is provided. The semiconductor package includes a substrate, afirst conductive layer, a second conductive layer, a first surface mountdevice, a second surface mount device and a connection element. Thefirst conductive layer is formed on the substrate and has a first padand a second pad separated from the first pad. The second conductivelayer is formed on the substrate and has a third pad and a fourth padelectrically connected with the third pad through the second conductivelayer. The first surface mount device is mounted on the first pad andthe third pad. The second surface mount device is mounted on the secondpad and the fourth pad. The connection element electrically connects thefirst pad with the second pad.

In yet another embodiment of the present invention, a semiconductorpackage is provided. The semiconductor package includes a substrate, afirst conductive layer, a second conductive layer, a first surface mountdevice, a second surface mount device, a first connection element and asecond connection element. The first conductive layer is formed on thesubstrate and has a first pad and a second pad separated from the firstpad. The second conductive layer is formed on the substrate and has athird pad and a fourth pad separated from the third pad. The firstsurface mount device is mounted on the first pad and the third pad. Thesecond surface mount device is mounted on the second pad and the fourthpad. The first connection element electrically connects the first padwith the second pad. The second connection element electrically connectsthe third pad with the fourth pad.

In yet another embodiment of the present invention, a semiconductorpackage is provided. The semiconductor package includes a substrate, afirst conductive layer, a second conductive layer, a connection element,a first surface mount device and a second surface mount device. Thefirst conductive layer is formed on the substrate and has a first padand a second pad separated from the first pad. The connection elementelectrically connecting the first pad with the second pad. The secondconductive layer is formed on the substrate and has a third pad, afourth pad and a fifth pad electrically connecting with each otherthrough the second conductive layer. The first surface mount device ismounted on the first pad, the third pad and the fourth pad. The secondsurface mount device is mounted on the second pad and the fifth pad.

In yet another embodiment of the present invention, a semiconductorpackage is provided. The semiconductor package includes a firstsubstrate, a first conductive layer, a first surface mount device (SMD)and a first bonding wire. The first substrate has a first top surface.The first conductive layer is formed on the first top surface and has afirst conductive element and a second conductive element separated fromeach other. The first SMD is mounted on the first top surface,overlapping with but electrically isolated from the first conductiveelement. The first bonding wire is electrically connect the first SMDwith the first conductive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a top view of a semiconductor package in oneembodiment of the invention.

FIG. 1B illustrates a cross-section view of a semiconductor package inone embodiment of the invention.

FIG. 2A illustrates a top view of a semiconductor package in oneembodiment of the invention.

FIG. 2B illustrates a cross-section view of a semiconductor package inone embodiment of the invention.

FIG. 3A illustrates a top view of a semiconductor package in oneembodiment of the invention.

FIG. 3B illustrates a cross-section view of a semiconductor package inone embodiment of the invention.

FIG. 4A is a top view illustrating a semiconductor package in accordancewith one embodiment of the invention.

FIG. 4B is a cross-sectional view of the semiconductor package takenalong DD′ line depicted in FIG. 4A.

FIG. 5A is a top view illustrating a semiconductor package in accordancewith one embodiment of the invention.

FIG. 5B is a cross-sectional view of the semiconductor package takenalong EE′ line depicted in FIG. 5A.

FIG. 6A is a top view illustrating a semiconductor package in accordancewith one embodiment of the invention.

FIG. 6B is a cross-sectional view of the semiconductor package takenalong FF′ line depicted in FIG. 6A.

FIG. 7A is a top view illustrating a semiconductor package in accordancewith one embodiment of the invention.

FIG. 7B is a cross-sectional view of the semiconductor package takenalong G1G1′ line depicted in FIG. 7A.

FIG. 7C is a cross-sectional view of the semiconductor package takenalong G2G2′ line depicted in FIG. 7A.

FIG. 8A is a top view illustrating a semiconductor package in accordancewith one embodiment of the present disclosure.

FIG. 8B is a cross-sectional view of the semiconductor package takenalong H1H1′ line depicted in FIG. 8A.

FIG. 9 is a top view illustrating a semiconductor package in accordancewith yet another embodiment of the present disclosure.

FIG. 10 is a cross-sectional view of the semiconductor package inaccordance with one embodiment of the present disclosure.

FIG. 11A is a top view illustrating a semiconductor package inaccordance with one embodiment of the present disclosure.

FIG. 11B is a cross-sectional view of the semiconductor package takenalong 1111′ line depicted in FIG. 11A.

FIG. 12 is a cross-sectional view of the semiconductor package inaccordance with one embodiment of the present disclosure.

FIG. 13A is a top view illustrating a semiconductor package inaccordance with one embodiment of the present disclosure.

FIG. 13B is a cross-sectional view of the semiconductor package takenalong J1J1′ line depicted in FIG. 13A.

FIG. 14 is a cross-sectional view illustrating a semiconductor packagein accordance with one embodiment of the present disclosure.

FIG. 15 is a cross-sectional view illustrating a semiconductor packagein accordance with one embodiment of the present disclosure.

DETAILED DESCRIPTION

FIG. 1A illustrates a top view of a semiconductor package in oneembodiment of the invention. FIG. 1B illustrates a cross-section view ofthe semiconductor package drawn along AA′ line in FIG. 1A.

Referring to FIG. 1A and FIG. 1B, a first pad 12 and a second pad 14 aredisposed on a surface 16 of a substrate 18. The substrate 18 may be aprinted circuit board (PCB), a semiconductor carrier board, or a packagesubstrate such as a ball grid arrays (BGA) substrate or a pin grid array(PGA) substrate.

Referring to FIG. 1A and FIG. 1B, via-plugs 22, 28 passing through thesubstrate 18 are respectively electrically connected to the first pad 12and the second pad 14, and may be electrically connected to conductiveelements such as traces (not shown) on at least one other surface of thesubstrate 18. In one embodiment, the via-plugs 22, 28 passing throughthe whole substrate 18 are formed by a method comprising formingopenings in the substrate by drilling, etching or emitting laser, andthen filling the openings with a conductive material e.g. copper,aluminum, etc.

In one embodiment, the via-plug 28 is formed in a space between thefirst pad 12 and the second pad 14. And the via-plug 28 electricallyconnects to the second pad 14. Therefore, the space between the firstpad 12 and the second pad 14 is used. It results in facilitatingminiaturization of IC packages, or increasing of an extra area foradditional elements or devices. Therefore, design flexibility of thesemiconductor package is enhanced.

In one embodiment, the via-plug 28 is electrically connected to thesecond pad 14 through a connecting member 25, as shown in an enlargeview in FIG. 1A. Referring to FIGS. 1A and 1B, the connection member 25may be formed together with the second pad 14. The via-plug 28 and theconnection member 25 are covered by a solder resistance layer 50 (shownin FIG. 1B, but not shown in FIG. 1A for the sake of brevity). At leasta portion of the first pad 12 and the second pad 14 is not covered bythe solder resistance layer 50 (FIG. 1B) so as to reveal openings. Inembodiments, the via-plug 28 and the second pad 14 are respectivelyformed in non-overlapping areas of the substrate 18, as shown in FIG.1A. In other word, the via-plug 28 is independent from the second pad14. An outline 24 of the via-plug 28 is generally a circle; an outline26 of the second pad 14 is generally a square, but not limited thereto.The outline 24 of the via-plug 28 is independent from the outline 26 ofthe second pad 14. In other words, the outline 24 and the outline 26 arenon-overlapping. In one embodiment, the outline 24 of the via-plug 28and the outline 26 of the second pad 14 are separated by the connectingmember 25.

Referring to FIGS. 1A and 1B, a surface mount device (SMD device) 20 maybe mounted on the first pad 12 and the second pad 14 on the surface 16of the substrate 18. The SMD device 20 may be a passive device e.g.capacitor, resistor, inductor or electrostatic discharge (ESD)component. The SMD device 20 includes a first electrode 32 and a secondelectrode 36, which are respectively electrically connected to the firstpad 12 through a first solder 30 and connected to the second pad 14through a second solder 34. The SMD device 20 overlaps with the via-plug28. In other word, the via-plug 28 is placed under the SMD device 20.

For example, the SMD device 20 is mounted on the surface 16 of thesubstrate 18 by a reflow process. In the beginning of the reflowprocess, a solder paste layer is printed in the openings defined by thesolder resistance layer 50 on the first pad 12 and the second pad 14.The SMD device 20 then is mounted on the surface 16 by putting the firstelectrode 32 of the SMD device 20 on the solder paste layer which isprinted on the first pad 12, and putting the second electrode 36 of theSMD device 20 on the solder paste layer which is printed on the secondpad 14. Thereafter, the substrate 18 and the SMD device 20 are heated bya reflow oven. During the heating process, the solder paste layer ismelted to form the first solder 30 and the second solder 34. Aftercooling down, the first solder 30 and the second solder 34 firmly fixthe SMD device 20 to the first pad 12 and the second pad 14.

In one embodiment, one of the first pad 12 and the second pad 14 is apower pad, and the other one is a ground pad. For example, the first pad12 is the power pad, and the second pad 14 is the ground pad.

A molding compound layer 66 covers the substrate 18 and structures onthe surface 16 of the substrate 18, so that various components such asthe first pad 12, the second pad 14, the SMD device 20 etc., areencapsulated and protected from mechanical and/or chemical damages, e.g.moisture, oxidization, external shocks and vibrations. The moldingcompound layer 66 may include an epoxy resin or other suitablematerials. In embodiments, the semiconductor package also includes othercomponents not shown in FIGS. 1A and 1B.

FIG. 2A illustrates a top view of a semiconductor package in anotherembodiment of the invention. FIG. 2B illustrates a cross-section view ofthe semiconductor package drawn along BB′ line in FIG. 2A.

The semiconductor package as shown in FIG. 2A includes a substrate 118.The substrate 118 may be a printed circuit board (PCB), a semiconductorcarrier board, or a package substrate such as a ball grid arrays (BGA)substrate or a pin grid array (PGA) substrate. A surface mount device(SMD device) 120 may be mounted on a first pad 112 and a second pad 114on the substrate 118 through a first solder 130 and a second solder 134,respectively electrically connected between a first electrode 132 of theSMD device 120 and the first pad 112 and between a second electrode 136of the SMD device 120 and the second pad 114. The SMD device 120 may bea passive device e.g. capacitor, resistor, inductor or electrostaticdischarge (ESD) component.

As shown in FIG. 2A, the semiconductor package further includes a firstconductive element 142 and maybe a second conductive element 144 formedon the substrate 118. The first conductive element 142 is formedphysically independent from the first pad 112. The second conductiveelement 144 may be formed in between the first pad 112 and the firstconductive element 142, and are separated from etch other, for exampleby an insulating layer such as a solder resistance layer 150 (FIG. 2B).

The first conductive element 142 electrically connects to a via-plug 146formed through the substrate 118, and electrically connects to the firstpad 112 through at least one bonding wire 140 lying across the secondconductive element 144. In one embodiment, two opposing ends of thebonding wire 140 are respectively bonded on a first bonding area 148connecting to the first pad 112 and a second bonding area 162 of thefirst conductive element 142. The first bonding area 148 and the secondbonding area 162 are defined by the solder resistance layer 150 (shownin FIG. 2B, but not shown in FIG. 2A for the sake of brevity) whichcovers a portion of the substrate 118 and reveals some openings forsoldering or wire bonding. The via-plugs 146, 128 (FIG. 2A) are formedthrough the substrate 118 and respectively electrically connected to thefirst conductive element 142 and the second pad 114.

As disclosed above, the SMD device 120 is mounted on the substrate 118by reflow process. In order to prevent a solder paste material fromflowing into the first bonding area 148, the solder resistance layer(not shown) may be used to cover an area 180 between the first bondingarea 148 and the first pad 112.

In one embodiment, the first conductive element 142 and the secondconductive element 144 may be a trace, a pad, a ring, or a finger. Oneof the first conductive element 142 and the second pad 114 is used fordistributing power signal, and the other of the first conductive element142 and the second pad 114 is used for connecting to a ground potential.For example, the second pad 114 is a ground pad. The first conductiveelement 142 is a power trace, a power ring, a power plane, or a powerfinger, electrically connected to the via-plug 146 or to the bonding padon a semiconductor (not shown in FIG. 2A for the sake of brevity). Inadditional, the second conductive element 144 is a signal trace fordistributing signal.

A molding compound layer 166 encapsulates structures on the substrate118 such as the first pad 112, the second pad 114, the SMD device 120,the first conductive element 142, the second conductive element 144,etc., to protect them from mechanical and/or chemical damages, e.g.moisture, oxidization, external shocks and vibrations.

FIG. 3A illustrates a top view of a semiconductor package in oneembodiment of the invention. FIG. 3B illustrates a cross-section view ofthe semiconductor package drawn along CC′ line in FIG. 3A.

The semiconductor package as shown in FIG. 3A includes a substrate 218.A surface mount device (SMD device) 220 may be mounted on a first pad212 and a second pad 214 on the substrate 218 through a first solder 230and a second solder 234, respectively electrically connected between afirst electrode 232 of the SMD device 220 and the first pad 212 andbetween a second electrode 236 of the SMD device 220 and the second pad214.

As shown in FIG. 3A, the semiconductor package further includes a firstconductive element 242, a second conductive element 244, a thirdconductive element 252, and a fourth conductive element 254, formed onthe substrate 218. The second conductive elements 244 are formed betweenthe first pad 212 and the first conductive element 242, and areseparated from each other, for example by an insulating layer such as asolder resistance layer 250 (FIG. 3B). The fourth conductive elements254 are formed between the second pad 214 and the third conductiveelement 252, and are separated from each other, for example by aninsulating layer such as the solder resistance layer 250 (FIG. 3B).

Moreover, the first conductive element 242 electrically connects to avia-plug 246 formed through the substrate 218, and electrically connectsto the first pad 212 through at least one bonding wire 240 lying acrossthe second conductive element 244. In one embodiment, two opposing endsof the bonding wire 240 are respectively bonded on a first bonding area248 connecting to the first pad 212 and a second bonding area 262 of thefirst conductive element 242. The third conductive element 252electrically connects to a via-plug 256 formed through the substrate218, and electrically connects to the second pad 214 through at leastone bonding wire 264 lying across the fourth conductive element 254. Inone embodiment, two opposing ends of the bonding wire 264 arerespectively bonded on a third bonding area 258 connecting to the secondpad 214 and a fourth bonding area 260 of the third conductive element252. In one embodiment, for example, the first bonding area 248, thesecond bonding area 262, the third bonding area 258 and the fourthbonding area 260 are defined by (or exposed by openings of) the solderresistance layer 250 (shown in FIG. 3B, but not shown in FIG. 3A for thesake of brevity).

As disclosed above, the SMD device 220 is mounted on the substrate 218by reflow process. In order to prevent a solder paste material fromflowing into the first bonding area 248 and the third bonding area 258,a solder resistance layer (not shown) may be used to cover an area 280between the first bonding area 248 and the first pad 212, and cover anarea 282 between the third bonding area 258 and the second pad 214.

Referring to FIG. 3A, one of the first conductive element 242 and thethird conductive element 252 is used for distributing a power signal andthe other of the first conductive element 242 and the third conductiveelement 252 is used for connecting to a ground potential. For example,the first conductive element 242 is a power trace, a power ring, a powerplane, or a power finger, electrically connected to the via-plug 246.The third conductive element 252 is a ground trace, a ground ring, or aground pad, electrically connected to the via-plug 256 or to the bondingpad on a semiconductor (not shown in FIG. 3A for the sake of brevity).The second conductive element 244 and the fourth conductive element 254are signal traces for distributing signals.

A molding compound layer 266 encapsulates structures on the substrate218 such as the first pad 212, the second pad 214, the SMD device 220,the first conductive element 242, the second conductive element 244,etc., to protect them from mechanical and/or chemical damages, e.g.moisture, oxidization, external shocks and vibrations.

In some embodiments of the present invention, the semiconductor packagefurther includes a heat-sink is mounted on the substrate. FIG. 4A is atop view illustrating a semiconductor package, named flip-chip ball gridarray (FC-BGA) package, in accordance with one embodiment of theinvention. FIG. 4B is a cross-sectional view of the semiconductorpackage taken along DD′ line depicted in FIG. 4A. The structure of thesemiconductor package depicted in FIG. 4 is similar to that of thesemiconductor packages depicted in FIGS. 2A-2B, except that thesemiconductor package of the present embodiment further has a heat-sink401 (shown in FIG. 4B, but not shown in FIG. 4A for the sake of brevity)mounted on the substrate 418 rather than being encapsulated by a moldingcompound.

As shown in FIGS. 4A and 4B, the semiconductor package includes asubstrate 418, a first pad 412, a second pad 414, a first conductiveelement 442, a surface mount device (SMD) 420, a first bonding wire 440,a second conductive element 444, a solder resistance layer 450, avia-plug 428 and a heat-sink 401. The first pad 412, the second pad 414,the first conductive element 442 are formed on the substrate 418. Thesurface mount device 420 is mounted on the first pad 412 and the secondpad 414. The first bonding wire 440 electrically connects a firstbonding area 462 of the first conductive element 442 with a secondbonding area 448 of the first pad 412. The second conductive element 444is formed on the substrate 418 and formed between the first pad 412 andthe first conductive element 442. The via-plug 428 formed in thesubstrate 418, covered by a solder resistance layer 450, located in aspace between the first pad 412 and the second pad 414, and electricallyconnected to the second pad 414.

In the present embodiment, the semiconductor package further includes aflip chip 40, such as a processing unit (CPU), bonded on the substrate418 with solder bumps 41 and the surface mount device 420 may serve as adecoupling capacitor, disposed adjacent to the chip 40. The heat-sink401 is mounted on a portion of the substrate 418 and the chip 40 by athermal compound 402, and at least one cavity 403 are thus defined amongthe heat-sink 401, the chip 40 and the substrate 418 to accommodate thefirst pad 412, the second pad 414, a portion of the solder resistancelayer 450 and the surface mount device 420 formed therein.

In one embodiment, one of the first pad 412 and the second pad 414 is apower pad, and the other one is a ground pad. The surface mount device420 is a decoupling capacitor. For example, the first pad 412 is thepower pad, and the second pad 414 is the ground pad.

FIG. 5A is a top view illustrating a semiconductor package, which may bea FC-BGA package shown in FIG. 4 or a wire-bonded BGA package (notshown), in accordance with one embodiment of the invention. FIG. 5B is across-sectional view of the semiconductor package taken along EE′ linedepicted in FIG. 5A. As shown in FIG. 5A, the semiconductor packageincludes a substrate 518 having a first patterned conductive layer 570and a second patterned conductive layer 590 formed thereon. The firstpatterned conductive layer 570 at least has a first pad 572 and a secondpad 574 separated from the first pad 572; and the second patternedconductive layer 590 has a third pad 592 and a fourth pad 594electrically connected with each other through the second patternedconductive layer 590. In other words, in the present embodiment, thefirst pad 572 and the second pad 574 has an identical level neverthelessthey are not connected with each other; and the third pad 592 and thefourth pad 594 are defined on a continuous layer with the same level.

A first surface mount device (SMD device) 520 disposed on the substrate518 may be mounted on the first pad 572 and the third pad 592 through afirst solder 530 and a second solder 534, wherein the first solder 530electrically connects a first electrode 532 of the surface mount device520 with the first pad 572, and the second solder 534 electricallyconnects a second electrode 536 of the surface mount device 520 with thethird pad 592. A second surface mount device 521 disposed on thesubstrate 518 may be mounted on the second pad 574 and the fourth pad594 through a third solder 531 and a fourth solder 535, wherein thethird solder 531 electrically connects a third electrode 533 of thesecond surface mount device 521 with the second pad 574, and the fourthsolder 535 electrically connects a fourth electrode 537 of the secondsurface mount device 521 with the fourth pad 594 (shown in FIG. 5B, butnot shown in FIG. 5 for the sake of brevity).

In some embodiments of the present invention, the first surface mountdevice 520 has a size substantially equal to that of the second surfacemount device 521. But in the present embodiment, the first surface mountdevice 520 has a size substantially greater than that of the secondsurface mount device 521.

The first pad 572 electrically connects to the second pad 574 through atleast one bonding wire 540. In one embodiment, two opposing ends of thebonding wire 540 are respectively bonded on a first bonding area 562 ofthe first pad 572 and a second bonding area 548 of the second pad 574.The first bonding area 562 and the second bonding area 548 are definedby a solder resistance layer 550 (shown in FIG. 5B, but not shown inFIG. 5A for the sake of brevity) which covers a portion of the first pad572 and the second pad 574 to reveal some openings for soldering or wirebonding. In the present embodiment, the bonding wire 540 lies across thefirst surface mount device 520. The more the bonding wires 540 arebonded, the less the impedance between two bonding areas.

In some embodiments of the present invention, an interconnectionstructure 501 may be used to either substitute the bonding wire 540 orfurther electrically connect the first pad 572 with the second pad 574.In the present embodiment, the semiconductor package further includes aninterconnection structure 501 having a plurality of via-plugs, such asvia-plugs 501 a and 501 b, and a metal layer 501 c formed in thesubstrate 518 used to further improved the electrical connection betweenthe first pad 572 with the second pad 574 to reduce their impedance. Thevia-plugs 501 a and 501 b respectively in contact with the first pad 572and the second pad 574; and one end of the metal layer 501 c directly incontact with the via-plug 501 a and the other end of the metal layer 501c directly in contact with the via-plug 501 b.

In one embodiment, the first surface mount device 520 and the secondsurface mount device 521 are decoupling capacitors. The first pad 572and the second pad 574 are the power pads, and the third pad 592 and thefourth pad 594 are the ground pads.

In some embodiments of the present invention, the semiconductor packagemay further include a molding compound layer 566 (shown in FIG. 5B, butnot shown in FIG. 5A for the sake of brevity) encapsulating thestructures formed on the substrate 518, such as a portion of thesubstrate, the first pad 572, the second pad 574, the third pad 592, thefourth pad 594, the bonding wire 540, the first surface mount device 520and the second surface mount device 521.

Yet, in some embodiments of the present invention, the semiconductorpackage may further include a heat-sink mounted (like the one as shownin FIG. 4B) on the substrate 518, having at least one cavity 403 toaccommodate the first pad 572, the second pad 574, the third pad 592,the fourth pad 594, the bonding wire 540, a portion of the solderresistance layer 550, the first surface mount device 520 and the secondsurface mount device 521.

FIG. 6A is a top view illustrating a semiconductor package, which may bea FC-BGA package shown in FIG. 4 or a wire-bonded BGA package (notshown), in accordance with one embodiment of the invention. FIG. 6B is across-sectional view of the semiconductor package taken along FF′ linedepicted in FIG. 6A. As shown in FIG. 6A the semiconductor packageincludes a substrate 618 having a first patterned conductive layer 670and a second patterned conductive layer 690 formed thereon. The firstpatterned conductive layer 670 at least has a first pad 672 and a secondpad 674 separated from the first pad 672; and the second patternedconductive layer 690 has a third pad 692 and a fourth pad 694 separatedfrom the third pad 692. In other words, in the present embodiment, thefirst pad 672 and the second pad 674 has an identical level neverthelessthey are not connected with each other; and the third pad 692 and thefourth pad 694 are also not connected with each other but has the samelevel.

A first surface mount device (SMD device) 620 disposed on the substrate618 may be mounted on a first pad 672 and the third pad 692 through afirst solder 630 and a second solder 634, wherein the first solder 630electrically connects a first electrode 632 of the first surface mountdevice 620 with the first pad 672, and the second solder 634electrically connects a second electrode 636 of the first surface mountdevice 620 with the third pad 692. A second surface mount device 621disposed on the substrate 618 may be mounted on the second pad 674 andthe fourth pad 694 through a third solder 631 and a fourth solder 635.In the present embodiment, the third solder 631 electrically connects athird electrode 633 of the second surface mount device 621 with thesecond pad 674, and the fourth solder 635 electrically connects a fourthelectrode 637 of the second surface mount device 621 with the fourth pad694 (shown in FIG. 6B, but not shown in FIG. 6A for the sake ofbrevity).

In some embodiments of the present invention, the first surface mountdevice 620 has a size substantially equal to that of the second surfacemount device 621. But in the present embodiment, the first surface mountdevice 620 has a size substantially greater than that of the secondsurface mount device 621.

The first pad 672 electrically connects to the second pad 674 through atleast one first bonding wire 640; and the third pad 692 electricallyconnects to the fourth pad 694 through at least one second bonding wire664. In one embodiment, two opposing ends of the first bonding wire 640are respectively bonded on a first bonding area 648 of the first pad 672and a second bonding area 662 of the second pad 674; and the twoopposing ends of the second bonding wire 664 are respectively bonded ona third bonding area 649 of the third pad 692 and a fourth bonding area663 of the second pad 674. The first bonding area 648, the secondbonding area 662, the third bonding area 649 and the fourth bonding area663 are defined by a solder resistance layer 650 (shown in FIG. 6B, butnot shown in FIG. 6A for the sake of brevity) which covers a portion ofthe first pad 672, the second pad 674, the third pad 692 and the fourthpad 694 to reveal some openings for soldering or wire bonding. In thepresent embodiment, the first bonding wire 640 lies across the firstsurface mount device 620. The more the bonding wires 640 and 664 arebonded, the less the impedance between two bonding areas.

In some embodiments of the present invention, the first bonding wire 640and the second bonding wire 664 may be respectively substituted by aninterconnection structure. In one preferred embodiment, thesemiconductor package may further include a first interconnectionstructure 601 and a second interconnection structure 602 respectivelyused to electrically connect the first pad 672 and the second pad 674and to electrically connect the third pad 692 and the fourth pad 694 toreduce their impedance.

In the present embodiment, the interconnection structure 601 has aplurality of via-plugs, such as via-plugs 601 a and 601 b and a metallayer 601 c. The via-plugs 601 a and 601 b respectively in contact withthe first pad 672 and the second pad 674; and one end of the metal layer601 c directly in contact with the via-plug 601 a and the other end ofthe metal layer 601 c directly in contact with the via-plug 601 b. Theinterconnection structure 602 has a plurality of via-plugs, such asvia-plugs 602 a and 602 b and metal layer 602 c. The via-plugs 602 a and602 b respectively in contact with the third pad 692 and the fourth pad694; and one end of the metal layer 602 c directly in contact with thevia-plug 602 a and the other end of the metal layer 602 c directly incontact with the via-plug 602 b.

In one embodiment, the first surface mount device 620 and the secondsurface mount device 621 are decoupling capacitors. The first pad 672and the second pad 674 are the power pads, and the third pad 692 and thefourth pad 694 are the ground pads.

In some embodiments of the present invention, the semiconductor packagemay further include a molding compound layer 666 (shown in FIG. 6B, butnot shown in FIG. 6A for the sake of brevity) encapsulating thestructures formed on the substrate 618, such as a portion of thesubstrate, the first pad 672, the second pad 674, the third pad 692, thefourth pad 694, the first bonding wire 640, the second bonding wire 664,a portion of the solder resistance layer 650, the first surface mountdevice 620 and the second surface mount device 621.

Yet, in some embodiments of the present invention, the semiconductorpackage may further include a heat-sink mounted (like the one 401 asshown in FIG. 4B) on the substrate 618, having at least one cavity 403to accommodate the first pad 672, the second pad 674, the third pad 692,the fourth pad 694, the first bonding wire 640, the second bonding wire664 the first surface mount device 620 and the second surface mountdevice 621.

FIG. 7A is a top view illustrating a semiconductor package, which may bea FC-BGA package shown in FIG. 4 or a wire-bonded BGA package (notshown), in accordance with one embodiment of the invention. FIG. 7B is across-sectional view of the semiconductor package taken along G1G1′ linedepicted in FIG. 7A. FIG. 7C is a cross-sectional view of thesemiconductor package taken along G2G2′ line depicted in FIG. 7A. Asshown in FIG. 7A the semiconductor package includes a substrate 718having a first patterned conductive layer 770 and a second patternedconductive layer 790 formed thereon. The first patterned conductivelayer 770 at least has a first pad 772, a second pad 774 and aconnection element 776 electrically connecting the first pad 772 withthe second pad 774; and the second patterned conductive layer 790 has athird pad 792, a fourth pad 794 and a fifth pad 796 electricallyconnecting with each other through the second patterned conductive layer790. In other words, in the present embodiment, the first pad 772 andthe second pad 774 are defined on a continuous layer with the samelevel; and the third pad 792 the fourth pad 794 and the fifth pad 796are defined on a continuous layer with the same level.

A first surface mount device (SMD device) 720 disposed on the substrate718 may be mounted on a first pad 772, the third pad 792 and the fourthpad 794 through a first solder 730, a second solder 734 and a thirdsolder 731, wherein the first solder 730 electrically connects a firstelectrode 732 of the first surface mount device 720 with the first pad772; the second solder 734 electrically connects a second electrode 736of the first surface mount device 720 with the third pad 792; and thethird solder 731 electrically connects a third electrode 733 of thefirst surface mount device 720 with the fourth pad 794. A second surfacemount device 721 disposed on the substrate 718 may be mounted on thesecond pad 774 and the fifth pad 796 through a fourth solder 735 and afifth solder 739. In the present embodiment, the fourth solder 735electrically connects a fourth electrode (not shown) of the secondsurface mount device 721 with the second pad 774, and the fifth solder739 electrically connects a fifth electrode (not shown) of the secondsurface mount device 721 with the fifth pad 796.

In some embodiments of the present invention, the first surface mountdevice 720 has a size substantially equal to that of the second surfacemount device 721. But in the present embodiment, the first surface mountdevice 720 has a size substantially greater than that of the secondsurface mount device 721. For example, the first surface mount device720 may have a width W1 substantially ranging from 0.6 to 6.4 mm; andthe second surface mount device 721 may have a width W2 substantiallyranging from 0.2 to 3.2 mm. In the present embodiment, the first surfacemount device 720 preferably has a width W1 about 1 mm and 1 μF(capacitance), and the second surface mount device 721 may have a widthW2 about 0.3 mm and 0.1 μF (capacitance). The connection element 776covered with the solder resistance layer 750 has a width W3substantially less than or equal to 600 μm (see FIG. 7B).

In some embodiments of the present invention, an interconnectionstructure 702 (see FIG. 7C) may be used to either substitute theconnection element 776 or further electrically connect the first pad 772with the second pad 774 to reduce their impedance. In one preferredembodiment, the semiconductor package may further include a firstinterconnection structure 702 and a second interconnection structure 701respectively used to electrically connect the first pad 772 and thesecond pad 774 and to electrically connect the third pad 792 and thefourth pad 794 to reduce their impedance.

In the present embodiment, the interconnection structure 701 has aplurality of via-plugs, such as via-plugs 701 a and 701 b and a metallayer 701 c. The via-plugs 701 a and 701 b respectively in contact withthe third pad 792 and the fourth pad 794; and one end of the metal layer701 c directly in contact with the via-plug 701 a and the other end ofthe metal layer 701 c directly in contact with the via-plug 701 b (seeFIG. 7B). The interconnection structure 702 has a plurality ofvia-plugs, such as via-plugs 702 a and 702 b and metal layer 702 c. Thevia-plugs 702 a and 702 b respectively in contact with the first pad 772and the second pad 774; and one end of the metal layer 702 c directly incontact with the via-plug 702 a and the other end of the metal layer 702c directly in contact with the via-plug 702 b (see FIG. 7C).

In one embodiment, the first surface mount device 720 and the secondsurface mount device 721 are decoupling capacitors. The first pad 772and the second pad 774 are the power pads, and the third pad 792, thefourth pad 794 and the fifth pad 796 are the ground pads.

In some embodiments of the present invention, the semiconductor packagemay further include a molding compound (shown in FIGS. 7B and 7C, butnot shown in FIG. 7A for the sake of brevity) layer encapsulating thestructures formed on the substrate 718, such as a portion of thesubstrate, the first pad 772, the second pad 774, the connection element776, the third pad 792, the fourth pad 794, the fifth pad 796, the firstsurface mount device 720 and the second surface mount device 721.

Yet, in some embodiments of the present invention, the semiconductorpackage may further include a heat-sink mounted (like the one as shownin FIG. 4B) on the substrate 718, having at least one cavity 403 toaccommodate the first pad 772, the second pad 774, the connectionelement 776, the third pad 792, the fourth pad 794, the fifth pad 796,the first surface mount device 720 and the second surface mount device721.

FIG. 8A is a top view illustrating a semiconductor package 800 inaccordance with one embodiment of the present disclosure. FIG. 8B is across-sectional view of the semiconductor package 800 taken along H1H1′line depicted in FIG. 8A. In one preferred embodiment, the semiconductorpackage 800 may be a system-in-package (SiP) including a substrate 801,a conductive layer 802, a SMD 803, a SMD 804, a solder resistance layer805 and a bonding wire 807.

The substrate 801 may be a PCB, a semiconductor carrier board, or apackage substrate such as a BGA substrate or a PGA substrate. Thesubstrate 801 has a top surface 801 a and a bottom surface 801 b. Theconductive layer 802 is formed on the top surface 801 a. In someembodiments, the conductive layer 802 is a patterned metal layer made ofmetal element, such as copper (Cu), aluminum (Al), silver (Ag), gold(Au) or the arbitrary combinations thereof, and includes at leastvarious kinds of separated conductive elements such as traces, guardingrings, fingers, pads, metal planes or plating lines. For example, theplating lines fill up the via-openings of the via-plugs 810 a and 811 awith the specified metals through the electroplating process.

In the present embodiment, the conductive layer 802 is a patternedcopper layer at least having a plurality of signal traces 802 a, a powerpad 802 b, a ground pad 802 c and a chip pad 802 d. Each of the signaltraces 802 a may be electrically connected to an internal/externaldevice (not shown) through a fingers or a via-plug 809 penetratingthrough the substrate 801 for distributing signal. The power pad 802 band the ground pad 802 c are electrically to a multi-channel powermanagement integrated circuit (PMIC) 812 through an interconnection 810and an interconnection 811 respectively.

In some embodiments, the interconnections 810 can be realized by avia-plug 810 a, a ball pad 810 d, a solder ball 801 b and a power planeor trace in a PCB 810 c; and the interconnections 811 can be realized bya via-plug 811 a, a ball pad 811 d, a solder ball 811 b and a groundplane or trace in a PCB 811 c. The via-plugs 810 a and 811 a penetratethrough the substrate 801 and electrically connected to the power pad802 b and the ground pad 802 c respectively. The ball pads 810 d and 811d are formed on the bottom surface 801 b of the substrate 801 oppositeto the first top surface 801 a and electrically connected to thevia-plugs 810 a and 811 a respectively. The solder balls 810 b and 811 bformed on the ball pads 810 d and 811 d are further electricallyconnected to the Vdd pins and the Vss pins of the PMIC 812 through thepower plane or trace in the PCB 810 c and the ground plane or trace inthe PCB 811 c respectively.

In order to prevent the solder paste from flowing through thevia-openings of the via-plugs 810 a and 811 a in which the via-plugs 810a and 811 a are formed to cause shorted traces (not shown) on the bottomsurface 801 b of the substrate 801, the via-openings of the via-plugs810 a and 811 a are preferably filled up by metal or dielectricmaterials after the via-plugs 810 a and 811 a are formed. The via-plug810 a and 811 a may preferably depart from the solder balls 801 b and811 b for a lateral distance D1 substantially less than 5 mmrespectively that will achieve less power impedance and IR drop withpower supply from the PMIC 812.

The solder resistance layer 805 is formed on the top surface 801 a tocover a portion of the conductive layer 802 and define a plurality ofbonding areas. For example, in the present embodiment, the solderresistance layer 805 formed on the conductive layer 802 is patterned toexpose portions of the power pad 802 b and the ground pad 802 c, so asto define a boning area on the power pad 802 b and define a boning areaon the ground pad 802 c.

The SMD 803 is mounted on the solder resistance layer 805 with an epoxypaste 819 that is formed on the top surface 801 a of the substrate 801;the SMD 803 overlaps with the conductive elements, such as traces,guarding rings, fingers, pads, metal planes or plating lines beneath thesolder resistance layer 805, but the SMD 803 is electrically isolatedfrom the conductive elements by the solder resistance layer 805.

In the present embodiment, the SMD 803 can be a surface-mount capacitorwith a capacitance from 0.1 μF to 22 μF mounted on the solder resistancelayer 805 and overlaps with the signal traces 802 a and the via-plug 809by an epoxy paste 819 but is electrically isolated from the signaltraces 802 a and the via-plug 809. However, the arrangement of the SMD803 and the conductive elements are not limited to these regards, anyconductive element resulted from the patterned conductive layer 802formed on the top surface 801 a of the substrate 801 may be overlappedby the SMD 803. Similarly, the via-opening of the via-plug 809 ispreferably filled up by metal or dielectric materials prior to themounting of the SMD 803.

In some embodiments of the present disclosure, the SMD 804 may bemounted on and directly contacted to the conductive layer 802 by anepoxy paste layer 806. For example, in some embodiments of the presentdisclosure, the SMD 804 can be a surface-mount device, e.g. a capacitor,a resistor, an inductor, a crystal oscillator or an electrostaticdischarge (ESD) component, mounted on the chip pad 802 d by an epoxypaste layer 806. However, the SMD 804 is not limited to be asurface-mount device. In some other embodiments, the SMD 804 can be aflip chip, such as an application processor (AP), bonded on thepatterned conductive layer 802 with solder bumps (not shown).

In the present embodiment, the SMD 803 is a surface-mount capacitorhaving two electrodes 803 a and 803 b covered with the noble metal (suchas gold, silver, platinum, or palladium), the SMD 804 is a surfacemounted chip having a plurality of input/out (I/O) pads 804 a, 804 b,804 c, 804 d and 804 e, and the electrodes 803 a and 803 b of the SMD803 are both electrically connected to the PMIC 812 and the second SMD804 by bonding wires respectively. In order to reduce the material costand improve the wire bondability or solderability and adhesion withepoxy paste in the package, the thickness of the noble metal covered onthe electrodes 803 a and 803 b is preferably less than 6 μm.

For example, the electrode 803 a of the SMD 803 is electricallyconnected to the bonding area defined on the power pad 802 b through thebonding wire 807; and the electrode 803 b of the SMD 803 is electricallyconnected to the bonding area defined on the ground pad 802 c throughthe bonding wire 814. In other words, the electrode 803 a of the SMD 803is electrically connected to the PMIC 812 through the bonding wire 807,the power pad 802 b of the conductive layer 802 and the interconnection810; and the electrode 803 b of the SMD 803 is electrically connected tothe PMIC 812 through the bonding wire 814, the ground pad 802 c and theinterconnection 811.

However, there may be more than one bonding wires, such as bonding wires807′, used to connect the electrode 803 a of the SMD 803 with the powerpad 802 b and more than one bonding wires, such as bonding wires 814′,used to connect the electrode 803 b of the SMD 803 with the ground pad802 c. The more wires are bonded or connected, the less power and groundimpedance can be achieved.

The bonding area defined on the power pad 802 b is electricallyconnected to the I/O pads 804 a and 804 b of the SMD 804 by the bondingwires 815 and 816; and the bonding area defined on the ground pad 802 cis electrically connected to the I/O pads 804 c and 804 d of the SMD 804by bonding wires 817 and 818. In other words, the electrode 803 a of theSMD 803 is electrically connected to the SMD 804 through the bondingwires 815 and 816, the power pad 802 b of the conductive layer 802 andthe bonding wires 807 and 807′; and the electrode 803 b of the SMD 803is electrically connected to the SMD 804 through the bonding wires 817and 818, the ground pad 802 c of the conductive layer 802 and thebonding wires 814 and 814′.

It should be appreciated that the arrangements of the power pad 802 b,the ground pad 802 c, the SMD 803 and the SMD 804 may not be limited asthese regards. In some embodiments of the present disclosure, therelative locations of the power pad 802 b, the ground pad 802 c, the SMD803 and the SMD 804 may be different, nevertheless the power pad 802 band the ground pad 802 c of the conductive layer 802 as depicted inFIGS. 8A and 8B are disposed between the SMD 803 and the SMD 804, butthe arrangement of the power pad 802 b and the ground pad 802 c iscritical to implement both the shorter charging and discharging pathsfrom the PMIC 812, and maintain better power integrity. The via-plug 810a may preferably depart from the bonding location of bonding wires 807′on the power pad 802 b for a distance substantially less than 3 mm. Thevia-plug 811 a may preferably depart from the bonding location ofbonding wires 814′ on the ground pad 802 c for a distance substantiallyless than 3 mm. In some embodiments of the present invention, thesemiconductor package may further include a molding compound layer 866encapsulating the structures formed on the substrate 801, such as aportion of the substrate, the power pad 802 b, the ground pad 802 c, thebonding wires 807, 814-818, and the SMDs 803 and 804. The semiconductorpackage of the present embodiment further has a heat-sink (shown in FIG.4B, but not shown in FIG. 8B for the sake of brevity) mounted on thesubstrate 801 rather than being encapsulated by a molding compound.

FIG. 9 is a top view illustrating a semiconductor package 900 inaccordance with yet another embodiment of the present disclosure. Thesemiconductor package 900 is similar to the semiconductor package 800depicted in FIGS. 8A and 8B, except that the SMD 803 implemented by asurface-mount capacitor is disposed between the SMD 804 implemented by asurface-mount chip and the power pad 802 b/the ground pad 802 c. Sincethe structure of the semiconductor package 800 is similar to that of thesemiconductor package 900, thus the identical portions thereof are notredundantly described.

By allocating the power pad 802 b, the ground pad 802 c, the SMD 803 andthe SMD 804, as discussed in FIGS. 8A, 8B and 9, a better decouplingpath with lower impedance can be provided. The direct current (DC) IRdroop caused by the path resistance of the electrical connection fromthe PMIC 812 to the semiconductor package 800 (or 900) in an idle stateand an alternating current (AC) dynamic voltage droop caused by the pathimpedance of a the electrical loop from the power net of PMIC 812 to thesemiconductor package 800 (or 900) and then return to the ground net ofPMIC 812 can be reduced, while the semiconductor package 800 (or 900) isworking, and the power integrity of the semiconductor package 800 (or900) can be improved.

Besides, because the SMD 803 can be stacked on the signal traces 802 a,the via-plug 809 or any other conductive elements resulted from thepatterned conductive layer 802 formed on the top surface 801 a of thesubstrate 801. Applying the SMD 803 serving as a decupling capacitor maynot occupy a large area of the semiconductor package 800 (or 900), incomparison with the conventional approach of which the decuplingcapacitor is directly mounted on the conductive layer. Such that thesize of the semiconductor package 800 (or 900) can be minimized. In someembodiment of the present disclosure, the SMD 803 can be an integratedpassive device (IPD) with at least four electrodes including the power,the ground and the radio frequency (RF) input/output signals, which areelectrically connected to the power pad 802 b, the ground pad 802 c, theI/O pads on the SMD 804 or signal pads in the conductive layer 802 (notshown).

FIG. 10 is a cross-sectional view of the semiconductor package 1000 inaccordance with one embodiment of the present disclosure. Thesemiconductor package 1000 is similar to the semiconductor package 800as depicted in FIG. 8B, except that the semiconductor package 1000further includes a substrate 1001 disposed between the substrate 801 andthe SMD 803.

In the present embodiment, the substrate 1001 is mounted on the solderresistance layer 805 that is formed on top surface 801 a of thesubstrate 801. The semiconductor package 1000 further includes aconductive layer 1002 formed on a top surface 1001 a of the substrate1001 departed from the top surface 801 a of the substrate 801, and theSMD 803 is mounted on and electrically connected to the conductive layer1002 by a solder paste layer 1003.

The electrode 803 a of the SMD 803 is electrically connected to thebonding area defined on the power pad 802 b through the bonding wire807; the electrode 803 a of the SMD 803 is electrically connected to thebonding area 1002 a defined on the conductive layer 1002 through aboding wire 1004, and the bonding area 1002 a is then electricallyconnected to the I/O pad 804 a of the SMD 804 through a bonding wire1005. The bonding area 1002 a is electrically connected to the bondingarea defined on the ground pad 802 c through a bonding wire 1006, andthe bonding area 1002 a is then electrically connected to the I/O pad804 b through the boding wire 1007. The electrode 803 b of the SMD 803can be electrically connected to the bonding area defined on the powerpad 802 b of the substrate 801 through the traces and the via-plug ofthe substrate 1001 or through the bonding wire (not shown). In order toreduce the material cost and improve the wire bondability orsolderability and adhesion with epoxy paste in the package, thethickness of the noble metal covered on the electrodes 803 a and 803 bis preferably less than 6 μm.

In some embodiment of the present disclosure, the semiconductor package1000 can further include another SMD 1008 mounted on the top surface1001 a of the substrate 1001. In the present embodiment, the SMD 1008 ismounted on the conductive layer 1002 and electrically connected to theSMD 803 through the trace of the conductive layer 1002 or through thebonding wire (not shown). The SMD 1008 can be a surface-mounted passivedevice, such as a capacitor, a resistor, an inductor, a crystaloscillator or an ESD component. Another embodiment of the presentdisclosure, the SMD 803 can be of integrated passive device (IPD) withat least four electrodes including the power, the ground and the radiofrequency (RF) input/output signals, which are electrically connected tothe power pad 802 b, the ground pad 802 c, the electrodes on the SMD 804or signal pads in the conductive layer 802 (not shown).

In some embodiments of the present invention, the semiconductor packagemay further include a molding compound layer 1066 encapsulating thestructures formed on the substrate 801, such as a portion of thesubstrate, the power pad 802 b, the ground pad 802 c, the bonding wires1004-1007, 815-818, the substrate 1001, and the SMDs 803, 804 and 1008.The semiconductor package of the present embodiment further has aheat-sink (shown in FIG. 4B, but not shown in FIG. 10 for the sake ofbrevity) mounted on the substrate 801 rather than being encapsulated bya molding compound. Since the structure of the semiconductor package1000 is similar to that of the semiconductor package 800, thus theidentical portions thereof are not redundantly described.

FIG. 11A is a top view illustrating a semiconductor package 1100 inaccordance with one embodiment of the present disclosure. FIG. 11B is across-sectional view of the semiconductor package 1100 taken along 1111′line depicted in FIG. 11A. In one preferred embodiment, thesemiconductor package 1100 may be a system-in-package (SiP) including asubstrate 1101, a conductive layer 1102, a SMD 1103, a SMD 1104, abonding wire 1114 and a bonding wire 1115.

The substrate 1101 may be a PCB, a semiconductor carrier board, or apackage substrate such as a BGA substrate or a PGA substrate. Thesubstrate 1101 has a top surface 1101 a and a bottom surface 1101 b. Theconductive layer 1102 is formed on the top surface 1101 a. In someembodiments, the conductive layer 1102 is a patterned metal layer madeof metal element, such as Cu, Al, Ag, Au or the arbitrary combinationsthereof, and includes at least various kinds of separated conductiveelements such as traces, guarding rings, fingers, pads, metal planes orplating lines.

In the present embodiment, the conductive layer 1102 is a patternedcopper layer at least having a plurality of fingers and traces 1102 a, apower pad 1102 b, a ground pad 1102 c and a chip pad 1102 d. Each of thefingers and traces 1102 a may be electrically connected to aninternal/external device (not shown) through a trace or a via-plug 1109penetrating through the substrate 1101 for distributing signal. Thepower pad 1102 b and the ground pad 1102 c are electrically connected toa PMIC 1112 through an interconnection 1110 and an interconnection 1111respectively.

In some embodiments, the interconnection 1110 can be realized by avia-plug 1110 a, a solder ball 1110 b, a ball pad 1110 d and a powerplane or trace in a PCB 1110 c, and the interconnection 1111 can berealized by a via-plug 1111 a, a solder ball 1111 b, a ball pad 1111 dand a ground plane or trace in a PCB 1111 c. The via-plugs 1110 a and1111 a penetrate through the substrate 1101 and electrically connectedto the power pad 1102 b and the ground pad 1102 c respectively. Thesolder balls 1110 b and 1111 b are formed on the bottom surface 1101 bof the substrate 1101 opposite to the top surface 1101 a andelectrically connected to the via-plugs 1110 a and 1111 a respectively.The solder balls 1110 b and 1111 b are further electrically connected tothe power (Vdd) pins and the ground (Vss) pins of the PMIC 1112 throughthe power plane or trace in the PCB 1110 c and the ground plane or tracein the PCB 1111 c respectively.

In some embodiments of the present disclosure, the SMD 1104 may bemounted on and directly contacted to the conductive layer 1102. Forexample, the SMD 1104 can be, but not limited to, an integrated chip atleast including surface-mount passive device e.g. a capacitor, aresistor, an inductor or an ESD component, mounted on the chip pad 1102d by an epoxy paste layer 1113. In some other embodiments, the SMD 1104can be a flip chip, such as a CPU or an application processor (AP),bonded on the patterned conductive layer 1102 with solder bumps (notshown).

In the present embodiment, the SMD 1104 has a size substantially greaterthan that of the SMD 1103. The SMD 1103 is a surface-mount capacitorwith a capacitance from 0.1 μF to 22 μF mounted on a top surface 1104 sof the SMD 1104 and electrically isolated from the conductive layer 1102by the SMD 1104. The SMD 1103 has at least two electrodes 1103 a and1103 b covered with the noble metal (such as gold, silver, platinum, orpalladium). The SMD 1104 is a surface mounted chip having a plurality ofI/O pads 1104 a . . . 1104 v, and the electrodes 1103 a and 1103 b ofthe SMD 1103 are both electrically connected to the PMIC 1112 and thesecond SMD 1104 by bonding wires and the interconnections 1110 and 1111respectively.

In the present embodiment a plurality of adjacent I/O pads may be unitedwith the power or ground net through the electrical interconnection inthe SMD 1104. Therefore, shortening the level and bevel pitches of I/Opads will reduce the power impedance and length of power charging anddischarging path. The I/O pads 1104 a . . . 1104 j of the SMD 1104 arearranged along a line L1 substantially perpendicular to one side D ofthe SMD 1104, and each two adjacent ones of the I/O pads 1104 a . . .1104 j have a level pitch LP substantially less than 500 μm. The I/Opads 1104 k . . . 1104 v are arranged along a line L2 adjacent to theline L1, and each two adjacent ones of the I/O pads 1104 k . . . 1104 valso have the same level pitch LP. In some embodiments, the SMD 1104 mayfurther have a plurality of I/O pads arranged in several lines (e.g.lines L3 and L4) substantially parallel to the side D of the SMD 1104,wherein each two adjacent ones of the I/O pads that are respectivelyarranged on two parallel lines L1 and L2 (or lines L3 and L4) may notalign with each other at a direction perpendicular to (or perpendicularto) the side D of the SMD 1104; and these two adjacent I/O pads may havea bevel pitch BL substantially less than 700 μm.

The electrode 1103 a of the SMD 1103 covered with the noble metal (suchas gold, silver, platinum, or palladium), on one hand, can beelectrically connected to the power pad 1102 b through the bonding wire1107. On the other hand, the electrode 1103 a of the SMD 1103 can beelectrically connected to the I/O pad 1104 c of the SMD 1104 through abonding wire 1114, and the I/O pad 1104 c is further electricallyconnected to the power pad 1102 b through a bonding wire 1115. In otherwords, the electrode 1103 a of the SMD 1103 can be electricallyconnected to the PMIC 1112 either through the bonding wire 1107, thepower pad 1102 b of the conductive layer 1102 and the interconnection1110 or through the bonding wire 1114, the I/O pad 1104 c, the bondingwire 1115 the power pad 1102 b of the conductive layer 1102 and theinterconnection 1110.

In another embodiment of the present disclosure, the I/O pad 1104 b maybe electrically connected to the I/O pad 1104 c by an interconnection ora trace in the SMD 1104 (not shown), and the I/O pad 1104 b is furtherelectrically connected to the electrode 1103 a of the SMD 1103 through abonding wire 1116. Such that, the electrode 1103 a of the SMD 1103 canalso be electrically connected to the PMIC 1112 through the bonding wire1116, the I/O pad 1104 b, the I/O pad 1104 c, the bonding wire 1115, thepower pad 1102 b of the conductive layer 1102 and the interconnection1110.

In yet another embodiment of the present disclosure, the electrode 1103a of the SMD 1103 may be electrically connected to the I/O pad 1104 earranged along the line L1 through a bonding wire 1120, the I/O pad 1104e is electrically connected to the I/O pad 1104 p arranged along theother line L2 by an interconnection or a trace in the SMD 1104 (notshown), and the I/O pad 1104 p is further electrically connected to thepower pad 1102 b through a bonding wire 1121. Such that, the electrode1103 a of the SMD 1103 can also be electrically connected to the PMIC1112 through the bonding wire 1120, the I/O pad 1104 e, the I/O pad 1104p, the bonding wire 1121, the power pad 1102 b of the conductive layer1102 and the interconnection 1110.

The electrode 1103 b of the SMD 1103 covered with the noble metal (suchas gold, silver, platinum, or palladium), on one hand, can beelectrically connected to the ground pad 1102 c through the bonding wire1117. On the other hand, the electrode 1103 b of the SMD 1103 can beelectrically connected to the I/O pad 1104 i of the SMD 1104 through abonding wire 1118, and the I/O pad 1104 i is further electricallyconnected to the ground pad 1102 c through the bonding wire 1119. Inother words, the electrode 1103 b of the SMD 1103 can be electricallyconnected to the PMIC 1112 either through the bonding wire 1117, theground pad 1102 c of the conductive layer 1102 and the interconnection1111 or through the bonding wire 1118, the I/O pad 1104 i, the bondingwire 1119, the ground pad 1102 c and the interconnection 1111.

In another embodiment of the present disclosure, the I/O pad 1104 h maybe electrically connected to the I/O pad 1104 i by an interconnection ora trace in the SMD 1104 (not shown), and the I/O pad 1104 h is furtherelectrically connected to the electrode 1103 b of the SMD 1103 through abonding wire 1122. Such that, the electrode 1103 b of the SMD 1103 canalso be electrically connected to the PMIC 1112 through the bonding wire1122, the I/O pad 1104 h, the I/O pad 1104 i, the bonding wire 1119, theground pad 1102 c of the conductive layer 1102 and the interconnection1111.

In yet another embodiment of the present disclosure, the electrode 1103b of the SMD 1103 may be electrically connected to the I/O pad 1104 jarranged along the line L1 through a bonding wire 1123, the I/O pad 1104j is electrically connected to the I/O pad 1104 v arranged along theother line L2 by an interconnection or a trace in the SMD 1104 (notshown), and the I/O pad 1104 v is further electrically connected to theground pad 1102 c through a bonding wire 1124. Such that, the electrode1103 b of the SMD 1103 can also be electrically connected to the PMIC1112 through the bonding wire 1123, the I/O pad 1104 j, the I/O pad 1104v, the bonding wire 1124, the ground pad 1102 c of the conductive layer1102 and the interconnection 1111.

In the present embodiment, the electrode 1103 a of the SMD 1103 mayelectrically connected to other I/O pad, such as the I/O pad 1104 w inthe central part of the SMD 1104, through a bonding wire 1127 to providepower source to an internal circuit or electrical element (not shown)built in the SMD 1104. The electrode 1103 b of the SMD 1103 mayelectrically connected to other I/O pad, such as the I/O pad 1104 x inthe central part of the SMD 1104, through a bonding wire 1128 to providea ground path to the internal circuit or electrical element (not shown)built in the SMD 1104. There is at least one bonding wire 1125 lyingacross the SMD 1103 to electrically connect a I/O pad (e.g. the I/O pad1104 f) of the SMD 1104 to another (e.g. I/O pad 1104 y in the centralpart of the SMD 1104). The semiconductor package 1100 may furtherinclude a plurality of fingers and traces 1102 a formed in the patternedthe conductive layer 1102 and electrically connected to the I/O pads1104 z formed in the peripheral region of the SMD 1104 through bondingwires 1126 for distributing other signals. When the SMD 1103 isimplemented by a surface-mount capacitor, the electrode 1103 a can bethe relay of electrical interconnection between the power pad 1102 b (orthe peripheral I/O pads of the SMD 1104, such as 1104 b, 1104 c, 1104 e,and 1104 p) and the I/O pad 1104 w in the central part of the SMD 1104through the bonding wires 1107, 1114-1116, 1120, 1121, and 1127. Theelectrode 1103 b can be the relay of electrical interconnection betweenthe ground pad 1102 c (or the peripheral I/O pads of the SMD 1104, suchas 1104 h, 1104 i, 1104 j, and 1104 v) and the I/O pad 1104 x in thecentral part of the SMD 1104 through the bonding wires 1117-1119,1122-1124, and 1128. In such embodiment, both the DC power supply and ACpower charging paths from the PMIC 1112 can be achieved. The length ofbonding wires can be also reduced. Accordingly, both the DC IR droop andAC dynamic voltage droop can be reduced.

In some embodiments of the present invention, the semiconductor packagemay further include a molding compound layer 1166 encapsulating thestructures formed on the substrate 1101, such as a portion of thesubstrate, the power pad 1102 b, the ground pad 1102 c, the bondingwires 1107, 1114-1128, and the SMDs 1103 and 1104. The semiconductorpackage of the present embodiment further has a heat-sink (shown in FIG.4B, but not shown in FIG. 11B for the sake of brevity) mounted on thesubstrate 1101 rather than being encapsulated by a molding compound.

FIG. 12 is a cross-sectional view of the semiconductor package 1200 inaccordance with one embodiment of the present disclosure. Thesemiconductor package 1200 is similar to the semiconductor package 1100as depicted in FIG. 11B, except that the semiconductor package 1200further includes a substrate 1201 disposed between the substrate 1101and the SMD 1103.

In the present embodiment, the substrate 1201 is mounted on the topsurface 1104 s of the SMD 1104. The semiconductor package 1200 furtherincludes a conductive layer 1202 formed on a top surface 1201 a of thesubstrate 1201 departed from the top surface 1104 s of the SMD 1104, andthe SMD 1103 is mounted on and electrically connected to the conductivelayer 1202 by a solder paste layer.

The bonding wire arrangement of the semiconductor package 1200 issimilar to that of the semiconductor package 1100, except that thebonding wires 1114, 1116, 1120 and 1127 that are used to electricallyconnecting the electrode 1103 a of the SMD 1103 with the SMD 1104, asdepicted in FIGS. 11A and 11B, are substituted by a bonding wire 1224electrically connecting the electrode 1103 a with a bonding area 1202 adefined on the conductive layer 1202 and a plurality of bonding wires1214, 1216, 1220 and 1227 electrically connecting the bonding area 1202a to the I/O pads 1104 c, 1104 b, 1104 e and 1104 w of the SMD 1104respectively; and except that the bonding wires 1118, 1122, 1123 and1128 that are used to electrically connecting the electrode 1103 b ofthe SMD 1103 with the SMD 1104, as depicted in FIGS. 11A and 11B, aresubstituted by a bonding wire 1225 electrically connecting the electrode1103 b with a bonding area 1202 b defined on the conductive layer 1202and a plurality of bonding wires 1218, 1222, 1223 and 1228 electricallyconnecting the I/O pads 1104 i, 1104 h, 1104 j and 1104 x of the SMD1104 respectively.

In some embodiment of the present disclosure, the semiconductor package1200 may further include another SMD 1208 mounted on the top surface1201 a of the substrate 1201. In the present embodiment, the SMD 1208 ismounted on the conductive layer 1202 and electrically connected to theSMD 1103 through a trace 1202 c of the conductive layer 1202. The SMD1208 can be a surface-mounted passive device, such as a capacitor, aresistor, an inductor, a crystal oscillator or an ESD component. In someembodiment of the present disclosure, the SMD 1103 can be an integratedpassive device (IPD) with at least four electrodes including the power,the ground and the radio frequency (RF) input/output signals, which areelectrically connected to the power pad 1102 b, the ground pad 1102 c,the I/O pads on the SMD 1104 or signal fingers and traces 1102 a in theconductive layer 1102.

Since the structure of the semiconductor package 1200 is similar to thatof the semiconductor package 1100, thus the identical portions thereofare not redundantly described. By allocating the power pad 1102 b, theground pad 1102 c, the SMD 1103 and the SMD 1104, as discussed in FIGS.11A, 11B and 12, a better decoupling path with lower impedance can beprovided. The DC IR droop caused by the path resistance of theelectrical connection from the PMIC 1112 to the semiconductor package1100 (or 1200) in an idle state and an AC dynamic voltage droop causedby the path impedance of a the electrical loop from the power net ofPMIC 1112 to the semiconductor package 1100 (or 1200) and then return tothe ground net of PMIC 1112 can be reduced, while the semiconductorpackage 1100 (or 1200) is working, and the power integrity of thesemiconductor package 1100 (or 1200) can be improved.

In some embodiments of the present invention, the semiconductor packagemay further include a molding compound layer 1266 encapsulating thestructures formed on the substrate 1101, such as a portion of thesubstrate, the power pad 1102 b, the ground pad 1102 c, the bondingwires 1107, 1115, 1117, 1119, 1121, 1124, 1126, 1214, 1216, 1218, 1220,1222-1224, 1227, 1228, the substrate 1201, and the SMDs 1103, 1104 and1208. The semiconductor package of the present embodiment further has aheat-sink (shown in FIG. 4B, but not shown in FIG. 12 for the sake ofbrevity) mounted on the substrate 1101 rather than being encapsulated bya molding compound.

FIG. 13A is a top view illustrating a semiconductor package 1300 inaccordance with one embodiment of the present disclosure. FIG. 13B is across-sectional view of the semiconductor package 1300 taken along J1J1′line depicted in FIG. 13A. The structure of the semiconductor package1300 is similar to that of the semiconductor package 800 as depicted inFIGS. 8A and 8B, except that the semiconductor package 1300 furtherincludes another SMD 1301 mounted on a bump pad 1306.

In the present embodiment, the patterned conductive layer 802 furtherincludes a bump pad 1306, a bump pad 1307 and a signal trace 802 eseparated with each other and arranged at the periphery of thesemiconductor package 1300. The SMD 1301 having a first electrode 1301 aand a second electrode 1301 b crosses over the bump pad 1306, the bumppad 1307, and the signal trace 802 e and mounted thereon by a solderpaste layer 1303 and an epoxy paste 1302. In some embodiments of thepresent disclosure, the SMD 1301 may overlap with the conductiveelements, such as traces, guarding rings, via-plugs, fingers, pads,metal planes or plating lines beneath the solder resistance layer 1304.The epoxy paste 1302 can be made of dielectric material, such as epoxyor other suitable material. In other words, the SMD 1301 is overlappingwith and electrically isolated from the bump pad 1307 and the signaltrace 802 e. The first electrode 1301 a is electrically isolated fromthe bump pads 1306 and 1307. The second electrode 1301 b is mounted onand electrically connected to the bump pad 1306 through the conductivepaste layer 1303. In some embodiments of the present disclosure, theconductive paste layer 1303 can be made of a solder, a conductive epoxyor conductive epoxy adhesive, such as conductive silver, copper, oraluminum epoxy or the like.

The first electrode 1301 a of the SMD 1301 can be electrically connectedto the bonding area 808 defined on the patterned conductive layer 802through the bonding wire 1305; and the second electrode 1301 b of theSMD 1301 can be (but not limited to) electrically connected to anexternal power or ground net (not shown) through the bump pad 1306.Wherein the bonding area 808 is separated from the bump pads 1306 and1307, and the signal trace 802 e. Multiple bonding wires 1305 can beused to reduce the impedance between the first electrode 1301 a and thebonding area 808.

In the present embodiment, the SMD 1301 can be a chip. However, it isnot limited to this regard. In some other embodiments, the SMD 1301 canbe a capacitor, an inductor, a resistor, an integrated passive device(IPD) or an electrostatic discharge (ESD) protection device. Since theidentical features and elements of the semiconductor package 1300 havebeen disclosed in FIGS. 8A and 8B as well the pertinent descriptionthereof, it will not be redundantly described again.

FIG. 14 is a cross-sectional view illustrating a semiconductor package1400 in accordance with one embodiment of the present disclosure. Thestructure of the semiconductor package 1400 is similar to that of thesemiconductor package 1300 as depicted in FIG. 13B, except that the SMD1401 is electrically connected to the bump pads 1306 and 1307.

In the present embodiment, the first electrode 1401 a is mounted on andelectrically connected to the bump pad 1037 through a first conductivepaste layer 1402; and the second electrode 1401 b is mounted on andelectrically connected to the bump pad 1306 through a second conductivepaste layer 1403. The first electrode 1401 a of the SMD 1401 can befurther electrically connected to the bonding area 808 defined on thepatterned conductive layer 802 through the bonding wire 1305; and thesecond electrode 1401 b of the SMD 1401 can be (but not limited to)electrically connected to an external power or ground net (not shown)through the interconnection (not show) electrically connecting to thebump pad 1306. Multiple bonding wires 1305 can be used to reduce theimpedance between the first electrode 1401 a and the bonding area 808.In some embodiments of the present disclosure, the bump pads 1306 and1307 can be of the power or ground pad.

FIG. 15 is a cross-sectional view illustrating a semiconductor package1500 in accordance with one embodiment of the present disclosure. Thestructure of the semiconductor package 1500 is similar to that of thesemiconductor package 1100 as depicted in FIG. 11B, except that the SMD1504 of the semiconductor package 1500 is mounted on bump pads 1501 aand 1501 b formed on the top surface 1104 s of the SMD 1104.

In the present embodiment, the bump pads 1501 a and 1501 b areconductive layers formed on the top surface 1104 s of the SMD 1104 bythe process for forming the I/O pads 1104 a . . . 1104 v of the SMD1104. The SMD 1504 is mounted on the bump pads 1501 a and 1501 b bypaste layers 1502 a and 1502 b. In some embodiments of the presentdisclosure, the paste layer can be made of dielectric material, such asepoxy or other suitable material. In some embodiments of the presentdisclosure, the paste layer can be made of a solder, a conductive epoxyor conductive epoxy adhesive, such as conductive silver, copper, oraluminum epoxy or the like. In some embodiments of the presentdisclosure, the bump pads 1501 a and 1501 b can be electricallyconnected to the power or ground net in the SMD 1104.

In the present embodiment, the SMD 1104 can be a chip. However, it isnot limited to this regard. In some other embodiments, the SMD 1504 canbe a capacitor, an inductor, a resistor, IPD or an ESD protectiondevice. Since the identical features and elements of the semiconductorpackage 1500 have been disclosed in FIGS. 11A and 11B as well thepertinent description thereof, it will not be redundantly describedagain.

According to the present disclosure, the semiconductor package has atleast following advantages. Miniaturization of IC packages isfacilitated. In addition, an extra area for additional elements, devicesor routing density is increased. Therefore, design flexibility of thesemiconductor package is enhanced.

While the disclosure has been described by way of example and in termsof the exemplary embodiment(s), it is to be understood that thedisclosure is not limited thereto. On the contrary, it is intended tocover various modifications and similar arrangements and procedures, andthe scope of the appended claims therefore should be accorded thebroadest interpretation so as to encompass all such modifications andsimilar arrangements and procedures.

What is claimed is:
 1. A semiconductor package, comprising: a substratehaving a top surface; a conductive layer formed on the top surface andhaving a first conductive element and a first pad separated from eachother; a surface mount device (SMD) mounted on the first pad,overlapping with and electrically isolated from the first conductiveelement; and a bonding wire electrically connect the SMD with the firstconductive layer.
 2. The semiconductor package according to claim 1,wherein the SMD comprises a first electrode and a second electrode; thebonding wire electrically connects the first electrode with a secondconductive element of the conductive layer; and the second conductiveelement is separated from the first pad.
 3. The semiconductor packageaccording to claim 1, further comprising a solder resistance layercovering a portion of the conductive layer and allowing the SMD mountedthereon.
 4. The semiconductor package according to claim 2, wherein thesecond electrode is mounted on and electrically connected to the firstpad through a conductive paste layer; and the first electrode is mountedon and electrically isolated from a second pad of the first conductivelayer through a solder resistance layer.
 5. The semiconductor packageaccording to claim 4, wherein the second pad is separated from the firstconductive element and the second conductive element.
 6. A semiconductorpackage, comprising: a first substrate having a first top surface; afirst conductive layer formed on the first top surface and having afirst conductive element and a second conductive element separated fromeach other; a first surface mount device (SMD) mounted on the first topsurface and electrically isolated from the first conductive element; afirst bonding wire electrically connect the first SMD with the firstconductive layer; and a second SMD having a second top surface and afirst bump pad disposed between the first substrate and the first SMD,through which the first SMD is mounted on the first bump pad of thesecond top surface and electrically isolated from the first conductiveelement.
 7. The semiconductor package according to claim 6, wherein thefirst SMD comprises: a first electrode electrically connected to thefirst conductive layer through the first bonding wire; and a secondelectrode electrically connected to a first I/O pad of the second SMDthrough a second bonding wire.
 8. The semiconductor package according toclaim 7, wherein the first conductive layer comprises a power pad and aground pad; the first I/O pad is electrically connected to the power padthrough a third bonding wire and further electrically connected to apower circuit through a first interconnection; and a second I/O pad ofthe second SMD is electrically connected to the ground pad through afourth bonding wire and further electrically connected to a groundcircuit through a second interconnection.
 9. The semiconductor packageaccording to claim 8, wherein the second SMD further comprises a thirdI/O pad disposed adjacent to the first I/O pad and electricallyconnected to the first electrode by a fifth bonding wire.
 10. Thesemiconductor package according to claim 9, wherein the third I/O padand the first I/O pad are arranged along a line substantially parallelto one side of the second SMD and have a level pitch substantially lessthan 500 μm.
 11. The semiconductor package according to claim 8, whereinthe second SMD further comprises a third I/O pad, the third I/O pad andthe first I/O pad are respectively arranged in two lines substantiallyparallel to one side of the second SMD and has a bevel pitchsubstantially less than 700 μm.
 12. The semiconductor package accordingto claim 8, wherein the second SMD further comprises a third and afourth I/O pads disposed on one side of the first SMD, which areopposite to the first and the second I/O pads, the third I/O padelectrically connected to the first electrode through a sixth bondingwire and the fourth I/O pad electrically connected to the secondelectrode through an seventh bonding wire.
 13. The semiconductor packageaccording to claim 7, wherein the second SMD comprises: a second bumppad formed on the second top surface; the first electrode mounted on andelectrically connected to the first bump pad; and the second electrodeis mounted on and electrically connected to the second bump pad.
 14. Thesemiconductor package according to claim 13, wherein the second bump padis electrically connected to a power or a ground net in the second SMD.15. A semiconductor package, comprising: a substrate having a topsurface; a conductive layer formed on the top surface and having a firstconductive element, a first bump pad and a second bump pad separatedfrom each other; a surface mount device (SMD) mounted on the first bumppad and the second bump pad; and a bonding wire is electricallyconnected the SMD with the first conductive layer.
 16. The semiconductorpackage according to claim 15, wherein the SMD overlaps with andelectrically isolates from the first conductive element.
 17. Thesemiconductor package according to claim 15, wherein the SMD comprises:a first electrode mounted on and electrically connected to the firstbump pad; and a second electrode is mounted on and electricallyconnected to the second bump pad.
 18. The semiconductor packageaccording to claim 15, wherein the second bump pad is electricallyconnected to a power or a ground net.
 19. The semiconductor packageaccording to claim 17, wherein the first electrode is electricallyconnected to the first conductive layer through the first bonding wire.